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Revolutionizing Semiconductor Processing with Yoha Solar’s Laser Scribing Technology

Revolutionizing Semiconductor Processing with Yoha Solar’s Laser Scribing Technology

2025-03-28

Yoha Solar has launched its latest laser scribing machine, poised to revolutionize semiconductor processing and solar panel production. Built around a state-of-the-art 1064nm fiber laser cutting system, the machine achieves ultra-fine cutting of silicon wafers, ceramic substrates, and even irregularly shaped cells with precision. The advanced laser source, offering ≤3% power stability, guarantees consistent performance and minimizes thermal and mechanical stresses during processing.

Key Features

Feature Description
Fiber Laser Technology Powered by a 1064nm fiber laser (㎡ <1.3 beam quality) for high-accuracy cutting (≤0.02mm precision).
Low-Power Laser Cutter Energy-efficient design with ≤1000W consumption and air-cooled operation.
Automated Workflow Double-station scribing structure for seamless integration into solar panel production lines.
Durability Maintenance-free, fully enclosed optical path with ≥100,000-hour service life.
Compact Design Space-saving dimensions (1300×760×1350mm) and user-friendly controls.


Specifications

Parameter Value
Laser Source 1064nm Fiber Laser Machine
Scribing Speed 600mm/s
Cutting Efficiency <1500pcs/h
Power Consumption ≤1000W (Low-Power Operation)
Electro-Optical Efficiency ≥35%
Compatible Cell Sizes 125/156/166/182/210mm (standard & non-standard)


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